Procurement
Decades of experience
Decades of sourcing quality electronic components have earned Smith a reputation as a pioneer in independent distribution.
Smith by the Numbers
$6B+
1H26 Revenue
Our total revenue in the first half of 2026 represents a 25% increase over our previous yearly high set in 2022.
15M
Images Captured by Argus™
Since its launch in 2025, our proprietary visual-inspection solution has captured and analyzed 15 million high-resolution part images.
6.5M
Parts Shipped Daily
We ship approximately 6.5 million parts each day to our customers around the world.
42
Years in Business
Founded in 1984, we have more than four decades of experience navigating the semiconductor supply chain.
FLEXIBILITY - STABILITY - MARKET
Locations
As the leading independent electronic-component distributor, Smith is at home all over the world, offering localized support on a global scale.
Houston
|
Smith World Headquarters
N.F. Smith & Associates, L.P.
5306 Hollister Street
Houston, TX, US 77040
Amsterdam
|
Smith Europe
Smith & Associates Europe B.V.
Alpha Tower, 22nd Floor
De Entree 45
Amsterdam, NL 1101 BH
Hong Kong
|
Smith Asia
Smith & Associates Far East Limited
Suites 3605-11, Tower Two, Times Square
1 Matheson Street
Causeway Bay, HK
Market Intelligence
STAY INFORMED WITH SMITH’S DYNAMIC MARKET INSIGHTS
The global electronics market is always changing. Stay informed on the best procurement and inventory strategy decisions with Smith’s monthly Market Intelligence Report.
Markey Byte 9.17.2026
Server CPUs in China have seen price increases of more than 10% month over month in some cases and exceed 40% year to date.
Markey Byte 9.15.2026
Demand for both QLC and TLC NAND continues to exceed supply growth, with QLC expanding at a slightly faster pace as hyperscale and archival storage deployments increase.
Markey Byte 9.10.2026
While pricing negotiations temporarily slowed activity in the memory market, the underlying supply-demand imbalance remains intact and is expected to continue into 2027.
Markey Byte 9.8.2026
Pricing pressure for active ICs is expected to continue through 2H26 and into 2027, with customers increasingly prioritizing supply assurance over price negotiations.
