Uncompromising component authenticity confirmation

Smith’s stereo and high-powered microscopes can magnify up to 500x to detect blacktopping, sanding, oxidation, and retinning.

Our high-definition microscopes can reproduce views as 60x HD images, allowing us to inspect components with unsurpassed color rendition and no distortion, delay, or interference.

With an integrated 2D/3D measurement system and extremely high depth of field, Smith’s high-magnification HD/3D microscope can capture any area in complete focus.

Utilizing x-ray imagery and independently developed algorithm software with artificial-intelligence functionalities, our fully automatic counting machine can accurately calculate the number of parts in a reel in seconds without unpacking or transferring the reel.

X-ray images are compared against OEM parts and are also used to verify that no voids have formed and to confirm leads and bond wires.

Smith’s XRF machine measures coating systems to determine coating thickness and composition and analyzes material content for small structures and small components.

C-SAM acoustic microscopy uses pulse-echo imaging to detect voids, cracks, and delaminations and penetrate blacktopping to expose markings.

Smith’s curve tracer performs reliability analysis, verifies pins and electrical continuity, and analyzes anomalous characteristics.

Smith’s LCR meter measures the impedance, capacitance, inductance, and resistance of passive components.

This test assesses component functionality at low and high temperatures as well as thermal-shock temperature cycling to verify that the component meets the manufacturer’s thermal-performance specifications.

With a built-in 144-pin driver, this device can verify read and write programmability and perform a blank check on more than 100,000 unique part numbers from nearly 400 different manufacturers.

Decapsulation is used to verify die size and manufacturers’ logos, inspect the architecture of the die, and confirm part numbers.

Heated-solvent testing exposes signs of counterfeiting by detecting sand marks, texture differences, and blacktopping.

Smith verifies the solderability of component leads to determine coating durability and checks for signs of corrosion and oxidation on aged products to establish usability. Wetting-balance testing is available at Smith’s Hong Kong hub.

Smith measures bond strengths and distributions and tests the integrity of materials used to attach dies or surface-mounted passive elements to determine compliance with bond-strength requirements.

Per RoHS 3 directive, Smith identifies restricted substances and tests for four phthalates: bis(2-ethylhexyl) phthalate (DEHP), benzyl butyl phthalate (BBP), dibutyl phthalate (DBP), and diisobutyl phthalate (DIBP).

Cross-section analysis is used to inspect the internal structure and composition of parts and identify defects that can cause component failure.