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Market Intelligence Report

Empowering insights on commodity and supply chain dynamics

Open-market activity provides a lens into broader market conditions and is often an early indicator of trends and supply chain disruptions. As electronic-component distribution channels have evolved in our increasingly connected world, tier-one OEMS and CMs have looked to open-market distributors as strategic partners to help balance their supply chains.

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Each month, Smith offers select customers access to our expertly curated Market Intelligence Report.

Our team of experts brings a diverse wealth of knowledge and experience that helps us offer the most relevant and actionable insights into the global electronic-component marketplace. From Smith’s decades in business and vast network of longstanding market relationships to the commodity, cross-industry, and regional expertise of our employees, we have connections and resources in place to keep you fully informed and help guide your purchasing strategies.

Market Bytes

Smith’s biweekly Market Bytes offer a quick at-a-glance into what’s going on in the worldwide electronic-component marketplace.
Markey Byte 9.17.2026
Server CPUs in China have seen price increases of more than 10% month over month in some cases and exceed 40% year to date.
Markey Byte 9.15.2026
Demand for both QLC and TLC NAND continues to exceed supply growth, with QLC expanding at a slightly faster pace as hyperscale and archival storage deployments increase.
Markey Byte 9.10.2026
While pricing negotiations temporarily slowed activity in the memory market, the underlying supply-demand imbalance remains intact and is expected to continue into 2027.
Markey Byte 9.8.2026
Pricing pressure for active ICs is expected to continue through 2H26 and into 2027, with customers increasingly prioritizing supply assurance over price negotiations.
Markey Byte 9.3.2026
MCU supply is tightening as wafer and packaging capacity become more constrained, though suppliers say this is not yet a repeat of the 2020-2022 shortage cycle.
Markey Byte 9.1.2026
Lead times for high-end AI and automotive MLCCs have extended to between 20 and 26 weeks, with some specialized products exceeding 30 weeks.
Markey Byte 8.27.2026
Future DDR5 roadmaps are expected to focus less on expanding product breadth and more on advancing density, bandwidth, and total memory-per-server capacity.
Markey Byte 8.25.2026
Many NAND suppliers are reallocating existing capacity away from lower-layer legacy products and toward higher-density, higher-value technologies.
Market Byte 8.20.2026
TSMC has reduced its 28-nanometer production by more than 25% so far this year, cutting monthly wafer output at its key Fab 15A from about 200,000 wafers per month to roughly 150,000.

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