News You Can Use – 6.3.19 – 6.7.19

As the leading independent distributor of electronic components, Smith tracks open-market activity and conditions as an early indicator of trends and supply chain disruptions. Industry news provides important and time-sensitive information when strategically procuring components, planning for NPIs, or making any critical decisions in the supply chain.

We’ve curated a selection of this week’s industry articles that we feel can help customers gain relevant, useful knowledge and prepare for any supply chain requirements.

Infineon to Acquire Cypress for $10B

German chipmaker Infineon has agreed to acquire Cypress Semiconductor for $10.1 billion. The acquisition, the largest in Infineon’s history, positions the company as the world’s top automotive supplier and gives the company skin in the game to compete with the rash of global IC acquisitions seen over the last five years.

In addition to catapulting to the top of the automotive chip supply chain, Infineon is also predicting growth in the industrial and IoT sectors. The company is expecting sales to decline 10% in 2019 but is hopeful for a rebound in 2020 and beyond, following this new acquisition. Read More

Worldwide Connected Vehicle Shipments Forecast to Reach 76 Million Units by 2023, According to IDC

International Data Corporation (IDC) estimates that worldwide shipments of connected vehicles will reach 51.1 million units in 2019, up 45.4% over last year. Growth in this area is not expected to slow down in the coming years. IDC estimates that, by 2023, worldwide connected vehicle shipments will reach 76.3 million units. A connected vehicle is defined as a light-duty vehicle or truck that has a dedicated cellular wireless wide area network that operates within the vehicle data. This massive growth for connected cars is due to consumer demand for a more immersive vehicle experience, evolving government regulations, and mobile-network operator investments. Read More

Chipmakers accelerate transition to 120/128-layer 3D NAND process

Falling NAND flash prices and increasing demand uncertainty are leading many chipmakers to step up technology advancements to be cost competitive. Specifically, chipmakers have increased the development of 120/128-layer 3D NAND flash process technologies. According to DigiTimes, some major NAND chipmakers have delivered samples of their 128-layer chips and are targeting the first half of 2020 for volume production. Despite cutting output levels in late 2018, chipmakers have been unsuccessful so far in stabilizing falling prices. Read More [1]

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